Disaggregating SoCs allows chipmakers to cram more features and functions into a package than can fit on a reticle-sized chip. But as Vidya Neerkundar, technical marketing engineer at Siemens EDA ...

A new technical paper titled “Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges” was published by researchers at the University of California, Santa Barbara and Columbia ...

HSINCHU, Taiwan--(BUSINESS WIRE)--Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the launch of its 2.5D/3D advanced package service. With ...

2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...

2.5D/3D IC designs present new challenges in both ESD design and verification. Advanced automated ESD verification methodology accurately and effectively evaluates ESD protection in 2.5/3D IC designs.

As AI models and computing demands continue to grow exponentially, the biggest challenge in chip design is no longer pure processing power, but the bandwidth gap between processors and memory. Even ...

STAr Technologies, a leading manufacturer of semiconductor test probe cards, unveiled the new 3D/2.5D MEMS micro-cantilever probe card for WAT reliability testing. The Virgo-Prima Series probe card is ...