Although LGA (land grid array) and BGA (ball grid array) packaging seem quite similar – LGA packaging is basically BGA packaging without the solder balls – there are some significant differences that ...

Yesterday, a report emerged claiming that Intel is planning to release its upcoming 14-nanometer Broadwell architecture processors as a ball grid array (BGA) rather than an land grid array (LGA) ...

For validating BGA and LGA devices with a 0.65-mm pitch, the company's latest hybrid socket adapter design deploys both male and female pins in an interstitial pattern. Its design provides the ...

– adapted to various socket locking systems: Twist lock, Knob lock, ZIF lock, Quicklock sockets – low profile solution: the adapter mounted together with the E-tec twist lock socket will only have a ...

There has been much speculation in the industry about whether Intel will stop making LGA package processors in favour of BGA package processors. Well, this speculation may have some traction in the ...

Claiming a breakthrough in fine-pitch socket technology for validating BGA and LGA devices, the company's 0.5-mm pitch BGA socket adapter system employs both male and female pins in an interstitial ...

Mobile processors these days don't come with sockets like desktop CPUs, but they're still manufactured for a specific package type. The package for AMD's "Phoenix" and "Hawk Point" processors is ...