When a power MOSFET fails, the challenge is to determine the root cause of failure and implement a containment plan. However, this is more easily said than done. The complexity of semiconductor ...
Printed-circuit-board (PCB) substrate material, like FR-4 glass epoxy, is a poor conductor of heat. Conversely, copper is an excellent conductor of heat. So, more copper area on a PCB is ideal from a ...
This application note provides guidelines for the handling and assembly of Freescale’s Heat Sink Small Outline Package (HSOP) and Power Quad Flat Package (PQFP) during printed circuit board (PCB) ...
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