KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is excited to announce its participation in the 2024 IPC APEX EXPO, scheduled to take ...

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

The solders used in the Electronic Industry are rapidly changing from Tin/Lead (Sn/Pb) solders to Lead-Free (Pb-Free) solders to meet new environmental and Green requirements. Many of these ...

Proper soldering of components into a single board is one of the major things to consider when assembling a circuitry. One must make sure that connections are positioned right, the soldering ...

One high-volume OEM proves that even simple feedback from an AOI system can reduce end-of-line defects by an order of magnitude. Until recently, the use of pre-reflow optical inspection usually was ...

SHENMAO America, Inc. is excited to introduce its Lead-Free Solder Paste PF606-P, designed specifically for the “Reverse Hybrid” assembly process. This new approach is revolutionizing board assembly ...